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Home > Intel Chip Chat - Archive > Hardware as the Next Innovation Layer: From Optane to FPGA’s and Beyond – Intel Conversations in the Cloud – Episode 141
Podcast: Intel Chip Chat - Archive
Episode:

Hardware as the Next Innovation Layer: From Optane to FPGA’s and Beyond – Intel Conversations in the Cloud – Episode 141
Category: Technology
Duration: 00:00:00
Publish Date: 2018-06-11 02:01:20
Description:

Intel Chip Chat – Network Insights audio podcast with Allyson Klein: In this episode of Conversations in the Cloud, Jacob Smith, SVP of engagement and Co-founder of Packet, joins us to discuss the promise of the cloud delivered on bare metal. Jacob and his brother founded Packet in 2014, with the intention of automating fundamental infrastructure. Jacob talks about Packet’s new collaboration with Intel to accelerate adoption of Intel Optane SSDs as a data center fast storage and memory solution. Packet will provide on-demand access to the Intel Xeon Scalable platform with large format Intel Optane technology at no cost. This will provide an easy way for open source and commercial software projects to benchmark and optimize this cutting edge technology, and unleash new innovations.

To learn more about Packet and how you can accelerate with Optane, visit:
acceleratewithoptane.com

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